Since the inception of our solder wire in 1974 ,we have been constantly contributing to the electronic industry with our innovative developments and unbeatable quality to meet the challenging requirements for specialized applications. Our RA ,RMA , No clean and halogen free cored solder wire have excellent wetting action , good spreading , thermal stability and reliable solder joints . The post solder residues of no clean &halogen free solder wire are totally nonconductive and non-corrosive hence no post solder cleaning is required . BOND solder wires meets all National, International , IPC , JIS , QQS 571 and MIL standards.
With strict ChloroFluoroCarbon Emission Regulation Act, the non-cleaning process of PCB is essential now. KTE has developed “NO CLEAN” and halogen free solder wire by a careful balance of resin and proprietary organic activatorswhich povide minimum residues, low spattering and excellent soldering. The most important feature of this solder wire is that after soldering , it leaves clear, inert and non-corrosive/ nonconductive residues which meets MIL-P-28809 cleanliness test and does not require post solder cleaning.
If you see through a sliced section of the “Bond multi layered solder wire”, you would see separate round cores of flux symmetricallyarranged around its perimeter. Only a thin wall of solder alloy separates the flux cores from the surface and the percentage of flux is not higher than the usual single cored wire.
The advantages of BOND MULTICORE SOLDER WIRE over single core: