PCB Lacquer or post flux is developed to prevent the surface of bare copper boards from oxidation and other contamination. High reliability resin used provides high oxidation prevention and fast drying.
KTE PCB lacquers have the following excellent features:
Tinning fluxes are availablein bothorganic no clean and inorganic formulations.
Inorganic tinning fluxes are used generally on materials, which are difficult to solder like brass and nickel coated components. Inorganic tinning fluxes can be used by dipping method and are recommended to washwith water.
No clean organic tinning flux: These fluxes are formulated to provide effective solder coat on terminals and standard wire leads . These fluxes are halide free , therefore they will not have any corrosion problem. Flux residue is decomposed during soldering process and leaves no residue and thus no washing is required.
This is heat stable organic water-soluble flux, formulated specially for use in the hot air levelling machine.
Copperlite chemical can be used as PCB precleaner, which ensures the solderability of printed boards by removing surface contaminations on the copper conductors. After that PCB can be preserved by roller tinning and lacquering.
Copperlite solution is water based and is a clear solution. It is suitable for silver surface also. The cleaning effect is almost instantaneous. After use, rinse the PCB in clean water and dry. Copper liteis available in solid as well as liquid form.
Roller tinning salt is highly active, water soluble, granular, acidic salt which is being used for roller tinning applications. The tinning of the PCB is accomplished by the transfer of solder from a metallic roller which is partially immersed in a bath of solder, with the pressure roller ensuring contact of the circuit surface with tinned metallic roller. Tinning salt is added to the molten solder very slowly. This is a non-spattering formation which gives a bright solder finish and full coverage in single pass.
ROLLER TINNING FLUX: This flux is designed for solder coating on printed circuit boards . Flux reside is water soluble and can be cleaned by rinsing with water. It gives a bright and smooth solder coated surface.
SS FLUX: This flux is inorganic and is developed for the soldering / plating of stainless steel , brass and bronze components.
