To meet the challenging requirement of SMT process , hybrid and chip bumping application, KTE has developed solder paste for Indian electronic industries. Solder paste is a homogenous mixture of finely graded oxide free pre-alloyed solder powder suspended on thixotropic flux. Extremely rapid flow,fastest wetting and zero defects are key features of BOND solder paste. RMA solder paste consists of ROLO type flux with very mild halidecontents meeting QQ-5-571E standards. Post solder flux residues are non tacky ,non conductive and non corrosive and providesgreater surface insulation resistancewith thermal stability.
NO CLEAN AND HALOGEN FREE LEADED SOLDER PASTE :Designed for fine pitch application and ensures continual printing ofmicro circuits . The flux in solder paste is Halide free and its residues are non corrosive ,non conductive which provides high insulation resistance and thermal stability. Hence no post solder cleaning is required.
| ALLOY COMPOSITION | Sn/Pb (63/37) | Sn/Pb/Ag (62/36/2) | Sn/Pb/Ag (63/36.6/0.4) |
|---|---|---|---|
| MELTING POINT °C | 183-184 | 179-190 | 179-190 |
| PARTICLE SIZE (µm ) | T4-22-38/ T3- 22~ 45 | T4 - 22-38/ T3- 22~45 | T4 - 22-38 / T3-22~45 |
| SHAPE | SPHERICAL | SPHERICAL | SPHERICAL |
| FLUX CONTENT | 10 ±0.50 % | 10 ±0.50% | 10 ±0.50% |
| VISCOSITY | 190±20 | 190±20 | 190±20 |
| SPREAD (%) | >90 | >90 | >90 |
| COPPER CORROSION TEST | PASSED | PASSED | PASSED |
Considering hazardous health and environment effects of lead metal, KTE has developed various compositions of lead free RoHS Compliant solder paste.
| ALLOY COMPOSITION | Sn/Ag/Cu (96.5/3.0/0.5) | Sn/Ag/Cu/Bi (96.2/0.3/0.5/3.0) | Sn/Bi (42/58) |
|---|---|---|---|
| MELTING POINT °C | 217-221 | 207-224 | 138 |
| PARTICLE SIZE( µm) | T4 - 38 ~22/ T5- 10 ~ 25 | 38 ~ 22 | 22 ~ 38 |
| SHAPE | Spherical | Spherical | Spherical |
| FLUX CONTENT | 11.5±0.3 % | 12±0.5 % | 11±0.5 % |
| VISCOSITY | 200±20 | 200±20 | 180±20 |
| SPREAD (%) | >75 | >75 | >75 |
| COPPER CORROSION TEST | PASSED | PASSED | PASSED |
KTE SMT glue is a thermosetting single component solvent free epoxy resins based adhesive especially developed for surface mounting of SMT components. It has good bonding strength, high electrical performance and is best suitable for consistent high speed dispensing / stencil printing.
BGA FLUX PASTE :This paste flux is formulated for use in BGA soldering with excellent wetting properties. It is completely Halide free and ensures long terms reliability of solder joints.
