Flux is indispensable in the soldering of electronic components and other applications. A soldering flux performs many functions, the most important of which is the removal of oxides film, other tarnished film and surface film from the metal to be soldered. It exposes clean surfaces for optimum wetting and solder ‘bond’ formation. A flux’s ability to prepare good surface for soldering is the measure of its activity.
From our long and vast experience, we have constantly researched flux technology and have developed various types of fluxes, which provide unrivaled performances.
NON ACTIVATED FLUX:
This flux is a mixture of high-quality WW resin and alcohol, having solid content between 30-40%. The excellent mobility of the flux is caused by the low surface tension. It is used where flux residue removal is not necessary or where the circuit is affected by low level current leakage. It is mainly used for wire and component lead tinning. Residue is non corrosive and meets all the requirements of MIL-standard.
KTE has developed special mildly active fluxes for electronic and electrical industries whereslightly active fluxes are required for foam fluxing as well as for dipping and brushing methods. The formulation of this flux has beenadjusted in such a manner thateven a low air pressure will produce a uniform head of foam bubbles. This flux is available in different compositions( solid contents etc ) .
Formulated for high speed and special soldering requirements of electrical components. This flux can be applied by dipping, foaming and spraying. The flux residue is too dry, non-sticky and non-corrosive but may require post solder cleaning in circumstances .The residue can easily be removed by using solvents.
The low solid fluxes areorganic based, having very low solid contents formulated for wave soldering of multilayer, single and double-sidedbare copper lacquer / OSP coated , solder plated printed circuit boards. These fluxes contain a small percentage of unique resin , proprietary activators and a special solvent system which leaves very thin , uniform and tack free transparent residues after soldering. Assemblies soldered with these fluxes have greater surface insulation resistance ,thermal stability and provides excellent performance in pin testing. The residues are non corrosive ,non conductive and non hygroscopic, hence no post solder cleaning is required. These fluxes are available in halogen free version also. Key features of our fluxes are : fast wetting , bridge free strong and reliable solder joints, no solder balls , better thermal stability and greater surface insulation resistance. Our fluxes are widely being used inconsumer , automobile , electrical , telecom and lighting industries .
ROSIN FREE NO CLEAN HALOGEN FREE FLUXES:These fluxes are rosin free having 1.5 to 2.5 % solid contents and are totally halide free. Due to the absence of halide and careful incorporation oforganic activator system, these fluxes are safe. The small residuesis nonconductive , non corrosive and non hygroscopic thus, no post solder cleaning is required. It passes all the tests prescribes as per IPC standards IPC TM 650 std 004 and QQS – 571. The residue on comb pattern board was tested to possess excellent surface insulation resistance and the SIR values observedhigher than 10magaohm /cm set by international standards. These fluxes are both effectively and popularly used in the consumer tele communication and computer industries. These fluxes are suitable for both bare copper and solder plated circuit boards.
This flux is formulated from organic compound dissolved in a suitable solvent of highest purity. Post soldering residue is water soluble and can be cleaned by using water. These highly effective fluxes are employed for various electronic soldering applications.
|S.No.||TYPE OF FLUX||COLOR||SPECIFIC GRAVITY AT 20ºC||SOLID CONTENTSWT (%)||RECOMMENDED APPLICATION|
|Colourless||0.795-0.800||1.5 TO 2.5|
|2||BOND 850 SERIES||Pale yellow||0.800-0.805||4-6|
|3||BOND 415 SERIES
BOND 415 HFSERIES
( HALOGEN FREE)
|Transparent light yellow||800±0.005||3.5±0.5|
|4||BOND 8 SERIES||Pale yellow||0.82±0. 005||13-15|
|5||BOND LF 8||Brownish yellow||0.820||12-13|
|6||SF-310Z MAT Finish||Transparent yellow||0.820||13-14|
|7||BOND 360D||Water white||0.860||3.5|