LEADED SOLDER PASTE: RMA

To meet the challenging requirement of SMT process , hybrid and chip bumping application, KTE has developed solder paste for Indian electronic industries. Solder paste is a homogenous mixture of finely graded oxide free pre-alloyed solder powder suspended on thixotropic flux. Extremely rapid flow,fastest wetting and zero defects are key features of BOND solder paste. RMA solder paste consists of ROLO type flux with very mild halidecontents meeting QQ-5-571E standards. Post solder flux residues are non tacky ,non conductive and non corrosive and providesgreater surface insulation resistancewith thermal stability.

NO CLEAN AND HALOGEN FREE LEADED SOLDER PASTE :Designed for fine pitch application and ensures continual printing ofmicro circuits . The flux in solder paste is Halide free and its residues are non corrosive ,non conductive which provides high insulation resistance and thermal stability. Hence no post solder cleaning is required.

KEY FEATURES:

  • Exhibits excellent wettability.
  • Ensures minimal slumping and prevents solder balling and bridging.
  • Transparent flux residue offers superior cosmetic appearance.
  • No post solder cleaning requirement saves process time and cost
ALLOY COMPOSITION Sn/Pb (63/37) Sn/Pb/Ag (62/36/2) Sn/Pb/Ag (63/36.6/0.4)
MELTING POINT °C 183-184 179-190 179-190
PARTICLE SIZE (µm ) T4-22-38/ T3- 22~ 45 T4 - 22-38/ T3- 22~45 T4 - 22-38 / T3-22~45
SHAPE SPHERICAL SPHERICAL SPHERICAL
FLUX CONTENT 10 ±0.50 % 10 ±0.50% 10 ±0.50%
VISCOSITY 190±20 190±20 190±20
SPREAD (%) >90 >90 >90
COPPER CORROSION TEST PASSED PASSED PASSED

RMA , NO CLEAN AND NO HALOGER LEAD FREE SOLDER PASTE

Considering hazardous health and environment effects of leadmetal , KTE has developed various compositions of lead free RoHS Compliant solder paste.

KEY FESATURES OF OUR LEAD FREE SOLDER PASTE :

  • Outstanding storage stability: There is hardly any change in viscosity and flux activity even if it is stored at the ordinary temperature ( below 35˚C) for three months ( Cosmo series )
  • The shelf life is one year from the date of manufacturing ( Cosmo series )
  • Excellent printability: It gives an excellent , continuous and stable printability even for fine pitch of 0.3mm.
  • Furthermore, it is still usable after being interrupted by long break.No solder ballsoccur after long hours of continuous printing.Even after stopping the line for one hour, the print quality is stable from the first point.
  • Durable high tackiness performance: Sufficient tackiness performance is obtained till24 hours after the printing. Mounting accuracy of the components is improved.
  • Excellent durability against preheat slumping: There is no slump at preheat temperature of 150-160˚C. No solder balls and no bridging at QFPs.
ALLOY COMPOSITION Sn/Ag/Cu (96.5/3.0/0.5) Sn/Ag/Cu/Bi (96.2/0.3/0.5/3.0) Sn/Bi (42/58)
MELTING POINT °C 217-221 207-224 138
PARTICLE SIZE( µm) T4 - 38 ~22/ T5- 10 ~ 25 38 ~ 22 22 ~ 38
SHAPE Spherical Spherical Spherical
FLUX CONTENT 11.5±0.3 % 12±0.5 % 11±0.5 %
VISCOSITY 200±20 200±20 180±20
SPREAD (%) >75 >75 >75
COPPER CORROSION TEST PASSED PASSED PASSED

SMT GLUE:

KTE SMT glue is a thermosetting single component solvent free epoxy resins based adhesive especially developed for surface mounting of SMT components. It has good bonding strength, high electrical performance and is best suitable for consistent high speed dispensing / stencil printing.

FEATURES:

  • Excellent adhesion and fast curing
  • Low moisture absorption
  • Stable at high speed dispensing / screen printing
  • Good bonding strength
  • Greater surface insulation resistance

BGA FLUX PASTE :This paste flux is formulated for use in BGA soldering with excellent wetting properties. It is completely Halide free and ensures long terms reliability of solder joints.

Lead free

Leaded