Flux cored Solder wire

Since the inception of our solder wire in 1974 ,we have been constantly contributing to the electronic industry with our innovative developments and unbeatable quality to meet the challenging requirements for specialized applications. Our RA ,RMA , No clean and halogen free cored solder wire have excellent wetting action , good spreading , thermal stability and reliable solder joints . The post solder residues of no clean &halogen free solder wire are totally nonconductive and non-corrosive hence no post solder cleaning is required . BOND solder wires meets all National, International , IPC , JIS , QQS 571 and MIL standards.

Bond no clean solder wires

With strict ChloroFluoroCarbon Emission Regulation Act, the non-cleaning process of PCB is essential now. KTE has developed “NO CLEAN” and halogen free solder wire by a careful balance of resin and proprietary organic activatorswhich povide minimum residues, low spattering and excellent soldering. The most important feature of this solder wire is that after soldering , it leaves clear, inert and non-corrosive/ nonconductive residues which meets MIL-P-28809 cleanliness test and does not require post solder cleaning.

Multicore advantage

If you see through a sliced section of the “Bond multi layered solder wire”, you would see separate round cores of flux symmetricallyarranged around its perimeter. Only a thin wall of solder alloy separates the flux cores from the surface and the percentage of flux is not higher than the usual single cored wire.

The advantages of BOND MULTICORE SOLDER WIRE over single core:

  • The flux is peripherally arranged, so it will obviously react and flow faster.
  • Wetting is faster, complete and uniform which means that you use less solder and transmit less heat to the joint area.
  • Since single core solder can frequently have flux voids, this problem will not be in multicore. Therefore, you can depend on continuity of the flux stream for complete wetting.

Water soluble organic flux core solder wires

This organic water-solubleflux cored wire is more effective than resin cored solder wire in soldering of different type of metals. The flux is more heat stable thus resulting in fast wetting ,minimum smoke and odour. The flux residue can be completely removed with a simple water rinse.

FEATURES OFBOND SOLDER WIRES

KTE manufactures all grades of resin cored , No clean , Halogen free and solid solder wire for specific requirements of electronics , automobile , consumers durables , telecom and electric industry. It is available in any size, grade , composition and flux percentage as per customer requirements .

FLUX TYPE PRODUCT CODE COMPOSITION FLUX CONTENT% SPREAD FACTOR% DIAMETER IN mm
RA SnPb Sn 63/Pb 37 2 to 3 >90 0.50 to 3.0
SnPb Sn60/Pb40 2 to 3 >90 0.50 to 3.0
SnPbAg Sn62/Pb36/Ag2.0 2 to 3 >90 0.50 to 3.0
SnPb Sn 50/Pb 50 2 to 3 >90 0.50 to 3.0
SnPb Sn 40/Pb 60 2 to 3 >90 0.50 to 3.0
SnPb Sn30/Pb70 2 to 3 >90 0.50 to 3.0
SnPb Sn 25/Pb 75 2 to 3 >90 0.50 to 3.0
SnPb Sn 20/Pb 80 2 to 3 >90 0.50 to 3.0
SnPbAg Sn5/Pb93.5/Ag1.5 2 to 3 >90 0.50 to 3.0
RMA SnPb Sn 63/Pb 37 2 to 3 >85 0.50 to 3.0
SnPb Sn 60/Pb40 2 to 3 >85 0.50 to 3.0
SnPbAg Sn62/Pb36/Ag2.0 2 to 3 >85 0.50 to 3.0
SnPb Sn 55/Pb45 2 to 3 >85 0.50 to 3.0
SnPb Sn 50/Pb50 2 to 3 >85 0.50 to 3.0
SnPb Sn 40/Pb60 2 to 3 >85 0.50 to 3.0
SnPb Sn 30/Pb70 2 to 3 >85 0.50 to 3.0
SnPb Sn 25/Pb75 2 to 3 >85 0.50 to 3.0
Sn Pb Sn 20/ Pb 80
SnPbAg Sn5/Pb93.5/Ag1.5 2 to 3 >85 0.50 to 3.0
Sn/ Zn Sn 70/ ZN 30 Solid 1.0 to 3.0
HALOGEN FREE& NO CLEAN
SnPb Sn63/Pb37 1.1 to 2.2 >80 0.50 to 3.0
SnPb Sn60/Pb40 1.1 to 2.2 >80 0.50 to 3.0
SnPbAg Sn62/Pb36/Ag2.0 1.1 to 2.2 >80 0.50 to 3.0
SnPb Sn 50/Pb50 1.2 to 2.2 >80 0.50 to 3.0
SnPb Sn 40/Pb 60 1.2 to 2.2 >80 0.50 to 3.0
SnPb Sn 25/Pb75 1.2 to 2.2 >80 0.50 to 3.0
SnPb Sn20/Pb80 1.2 to 2.2 >80 0.50 to 3.0
SnPbAg Sn5/Pb93.5/Ag1.5 1.2 to 2.2 >80 0.50 to 3.0

SOLDERING IRON TIP TINNER:

Tip Tinner is a mixture of solder powder and thermally stable oxide reducing compound. It provides fast cleaning and re tinning of oxidized soldering iron TIP better than wet sponge . it is available in leaded and lead free alloy compositions.

LEAD FREE

LEADED