KHANNA TRADERS & ENGINEERS
An ISO 9001:2008 & 14001:2004 CERTIFIED COMPANY
Properties of Recommended Lead free solder
KTE has found that the following alloys meet the requirements of its customers in most printed circuit board assembly applications.
It provides the following features:-
| Product code | Composition | Melting Point ˚C | Tensile strength 10mm/ min | Elongation % | Recommended Application |
| Sn100Cu | Sn0.7Cu | 227 | 32 | 48 |
Recommended for wave soldering, Tinning |
| SnAg* | Sn96Ag | 221 | 46 | 33 |
High strength solder for elevated temperature recommended for both wave and Reflow soldering |
| SnAgCu* | Sn963AgCu | 218-219 | 50 | 32 |
Reliable solder for wave, Reflow soldering and for SMT components. Smooth Bright joint pads for Hot Air leveling boards |
| SnSb | Sn5Sb | 236-243 | 46 | 38 |
For high temperature soldering |
* Patented Product: - US Patent number 5527628
