KHANNA TRADERS & ENGINEERS

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LOW RESIDUE FLUXES (RNC-4 AND BOND N/C)

RNC-4 and BOND N/C are very low residue organic fluxes formulated for wave soldering of high end electronic assemblies. It is designed for both multilayer, single and double sided copper bare boards. These fluxes contain a small percentage of unique resin and a special solvent system which gives assemblies a very uniform and tack free residue that is fully compatible with resin pre flux coating. Assemblies soldered with this flux have high surface insulation resistance and the residue is even no clean type. As these fluxes have very low solid content, it gives assemblies a cleaner appearance as compared to normal RMA or RA type fluxes. For single sided board it gives good soldering performances at lower pre heating temp. This low residue flux also prevents thermal shock of SMD components. It is being used in the TV, RADIO, VCR, TELEPHONE and COMPUTER industries. NON RESIDUE FLUX (BOND 620-F AND BOND 620-M) Bond 620-F and Bond 620-M are both non residue halide free fluxes with very low solid content varying from 1.5 - 2.5%. Due to the absence of corrosive halide and careful incorporation of activator-solvent system, the flux is economical. The small residue is non-conductive. Thus, no cleaning is required and it passes all the tests, even the most sensitive COPPER MIRROR test cleaning per QQ-S571 and IPC-TM650. The residue on comb pattern board was tested to possess good surface insulation resistance : a few power of magnitude higher than 10" ohm.cm set by international standards. These fluxes are both effectively and popularly utilized in the consumer tele communication and computer industries. These fluxes are suitable for both bare copper and solder coated circuit boards.

 

BOND FLUX SELECTION GUIDE

 

Item
Product
Colour
Solid content (%)
Sp. Gr. at 20 oC
Viscosity in cps at 20oC
Application
BOND-s
Brown liquid
20
0.840
4.0

Best used for vertical dip soldering and for deflection components.

BOND-8
light brown liquid
15
0.825
3.50

Suitable for high density boards. This flux has high reliability and solderability for TV & Audio products.

BOND N/C
light yellow liquid
3-4
0.795
3.0

Very low transparent residue, ideal for telephone & telecom boards. Good contact for checker pins.

Bond N/C (MAT type)
-do-
4-5
0.795
3.0

Provides non cleaning most suitable for TV, Audio, Computer Monitor boards, non washing type.

RNC-4 (MAT type)
-do-
4-5
0.795
3.0

Most suitable for soldering printed circuit boards with both   chip and discrete components. Superior insulation resistance.

SF-310Z
Water white
15
0.825
4.0
BOND-620 F & M (N0- CLEAN)
Colour-less
1.5-2.5
0.800-0.815
3.0

Halide, resin free no clean type. Suitable for both bare copper & solder coated circuit boards. Most suitable for computer mother board, telecom & other very sophisticated soldering work.

BOND 360-D
Water white
3.5
0.860
5.5

Neutral type flux. Very suitable for mother board, multilayer soldering etc., Provide soldering for copper & nickel base alloys.

Pre flux
Brown liquid
30
0.920
13

High reliability resin provides high oxidation prevention and heat resistance, excellent compatibility with post flux. Best suited for reflow soldering.

Tinning flux
Colour less
15-20
1.007
20

Excellent for Tinning of PCB's, copper cleaning and for high density electronic boards. But cleaning with deionised water is necessary.