Lead Free Solder Paste

Lead Free Solder Paste

Properties	SSP – 4032S	SSP – 4032SL
Alloy Composition	Sn3.5Ag*	Sn3.0Ag0.5Cu*
Melting point ˚C	221˚C	216 – 220˚C
Particle size	45 – 22µm	45 – 22µm
Shape	Spherical	Spherical
Flux content	10.5 – 11.0%	10.5 – 11.0%
Halide content	0.04%	0.04%
Viscosity	220 – 230mPa.s.	220 – 230mPa.s.
Spread	90% and above	90% and above
Copper Corrosion test	Passed	Passed
Features	Good in wetting upto 0.3mm Pitch, continuous printability, used for both air and N2 Reflow	Good in dealing with 0.33mm Pitch, no solder balling defect, maximum wettability, used for both air and N2 Reflow

* Patented Product: - US Patent number 5527628

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