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Lead Free Solder Paste

Lead Free Solder Paste

Properties SSP – 4032S SSP – 4032SL
Alloy Composition Sn3.5Ag* Sn3.0Ag0.5Cu*
Melting point ˚C 221˚C 216 – 220˚C
Particle size 45 – 22µm 45 – 22µm
Shape Spherical Spherical
Flux content 10.5 – 11.0% 10.5 – 11.0%
Halide content 0.04% 0.04%
Viscosity 220 – 230mPa.s. 220 – 230mPa.s.
Spread 90% and above 90% and above
Copper Corrosion test Passed Passed
Features

Good in wetting upto 0.3mm Pitch, continuous printability, used for both air and N2 Reflow 

Good in dealing with 0.33mm Pitch, no solder balling defect, maximum wettability, used for both air and N2 Reflow

 

* Patented Product: - US Patent number 5527628 

 

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