KHANNA TRADERS & ENGINEERS

         An ISO 9001:2008 & 14001:2004 CERTIFIED COMPANY

FLUX CORED SOLDER WIRE

FLUX CORED SOLDER WIRE

Our 'bond' series of resin cored solder wire was first introduced in the market in 1974. Ever since we have been constantly contributing to the electronic industry with our diverse types of solder wires, developed to meet the various requirement for specialized applications. Both RMA and RA type cored wire have excellent wetting action of core flux and an even more important and significant fact is that the flux is totally non-conductive and non-corrosive. 'bond" resin cored series of solder wire meets all the National, International and MIL std. QQ-S 571, 'Specs.'

 

WATER SOLUBLE ORGANIC FLUX CORE SOLDER WIRE

This organic water soluble cored wire is more effective than resin cored solder wire, in soldering difficult metals. The flux is more heat stable thus resulting in minimum smoke and odour. The flux residue can be completely removed with a simple water rinse.

 

NO-CLEAN SOLDER WIRE

With stricter Fluorocarbon Emission Regulation Act, the non-cleaning process of PCB is essential now. KTE has developed "NO-CLEAN" solder wire by a careful balance of resin and activator to provide minimum residue and excellent reliable joint with low spattering. The most important feature of this solder wire is that after soldering it leaves clear, inert and non corrosive residue, which enhance exceptional wetting on the pads of PCB. It meets MIL-P-28809 cleanliness test and does not require any cleaning.

 

MULTICORE ADVANTAGE

If you were to slice through a section of the ''bond multicored solder wire, you would see separate round cores of flux symmetrically arranged around its perimeter. Only a thin wall of solder separates the flux cores from the surface and the percentage of flux is not higher than the usual single cored wire. This says a lot about the precision manufacturing capability.

 

The advantage of "bond" multicore solder wire over single core

  • The flux is peripherally arranged, so it will obviously react and flow faster.
  • Since single core solder can frequently have flux voids, this is eliminated with multicore. Therefore you can depend on continuity of the flux stream for complete Wetting.
  • Wetting is faster, complete and uniform which means that you use less solder and transmit less heat to the joint area.

 

GENERAL SOLDER WIRE

KTE manufactures all grades of resin cored and solid solder wire for all the general requirements of electronic soldering and is also available in any size, even upto 25 SWG.

 

Grade

Melting Range 0C

Application

Sn63
183
General Application
Sn60
183-188
General Application for Electronic Soldering
Sn50
183-212
For Popular Purposes
Sn40
183-234
For Lead Pipes and Tin Containers
Sn30
183-240
For Ordinary Soldering as well as in automobile use
Sn25
183-240
For High Temperature Soldering
Sn70 Z30
199
Capacitor Grade
Sn80 Zn20
200
Capacitor Grade
Sn95 Sb5
232
For High Temperature Soldering

 

HMP-HIGH MELTING POINT SOLDER

A special alloy has been derived for high temperature application e.g. in electric motor, car radiators and high temperature lamps. HMP is also ideal for prevention of reflows of the first connection, where joints are made successively or are very dense.

 

LOW MELTING POINT ALLOY

KTE has developed an alloy that has the lowest melting point. This high performance wire core solder is used because of its low temperature. It is excellent for heat sensitive components, to solder them in the vicinity of previously soldered joints and also for soldering gold plated surfaces.